{"id":428,"date":"2012-11-19T14:57:55","date_gmt":"2012-11-19T12:57:55","guid":{"rendered":"http:\/\/kunden.i-cue-medien.de\/www.mkvs.de\/en\/?page_id=428"},"modified":"2026-05-20T13:33:02","modified_gmt":"2026-05-20T11:33:02","slug":"monday","status":"publish","type":"page","link":"https:\/\/www.mkvs.de\/en\/program\/monday\/","title":{"rendered":"Monday, October 26, 2026"},"content":{"rendered":"<p><span style=\"color: #2c5487; text-transform: uppercase; font-size: 16px; font-weight: bold;\"> Already submitted papers<\/span><\/p>\n<p><strong>Albert Invent; US-Oakland<\/strong><br \/>\nTBA<\/p>\n<p><strong>artimelt; CH-Sursee<\/strong><br \/>\nTBA<\/p>\n<p><strong>Aumovio Germany; DE-Babenhausen<\/strong><br \/>\nDisplay Bonding \u2013 Complex &amp; Challenging Technology<\/p>\n<p><strong>AWA Alexander Watson Associates; NL-Amsterdam<\/strong><br \/>\nGlobal Pressure-Sensitive Adhesives Market Overview<\/p>\n<p><strong>ENTEX Rust &amp; Mitschke; DE-Bochum<\/strong><br \/>\nEasy Processing of Challenging Adhesives Formulations Using a Planetary Roller Extruder<\/p>\n<p><strong>Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM; DE-Bremen<\/strong><br \/>\nSeparation of Paperboard \/ Polymer Composite Food Packaging by Autonomous Debonding<\/p>\n<p><strong>GEW (EC) Ltd.; UK-Crawley<\/strong><br \/>\nClosed-Loop Ultraviolet (UV) Dose Control For UV-Curable HMPSA<\/p>\n<p><strong>Henkel Adhesive Technologies; DE-D\u00fcsseldorf<\/strong><br \/>\nFrom Supplier Data to Digital Product Passports: A Packaging Adhesives Use Case<\/p>\n<p><strong>Jagenberg Converting Solutions; DE-Erlangen<\/strong><br \/>\nUnlock the Full Potential of your Pressure Sensitive Adhesive Products: The rise of Slot Die Coating<\/p>\n<p><strong>Jowat; DE-Detmold<\/strong><br \/>\nTBA<\/p>\n<p><strong>LabV Intelligent Solutions; DE-Selb<\/strong><br \/>\nShorter Development Cycles in Adhesive Formulation: AI Methods on a Harmonised Data Foundation<\/p>\n<p><strong>Matthews Engineering; CH-Fribourg<\/strong><br \/>\nEvolution of Gravure Coating Technology: From Overflow Chambers to Pressurized Gravure Systems and their Position Versus Curtain Coating<\/p>\n<p><strong>Mondi Group; DE-Raubling<\/strong><br \/>\nInsights into the Release Liner Toolkit \u2013 Selecting the Right Tool for Pressure-Sensitive Adhesives<\/p>\n<p><strong>Molecular Plasma Group; BE-Leuven (Kessel-Lo)<\/strong><br \/>\nTBA<\/p>\n<p><strong>PTS &#8211; Institut f\u00fcr Fasern &amp; Papier; DE-Heidenau<\/strong><br \/>\nCOLLAMELT \u2013 Collagen-Based Thermoplastic Adhesives and Sealing Materials for the Paper Industry<\/p>\n<p><strong>Rain Carbon Germany; DE-Duisburg<\/strong><br \/>\nTackifier Resins in UV-Curable PSA Tapes: Selective Tackifier Use for Performance and Efficient Curing<\/p>\n<p><strong>Synthomer; DE-Marl<\/strong><br \/>\nPressure-Sensitive Adhesives Enabling Recycling for PET And HDPE<\/p>\n<p><strong>Synthomer; DE-Marl<\/strong><br \/>\nSustainability In Polymer Dispersions for Tape and Label Applications<\/p>\n<p><strong>Uncountable Inc.; US-San Francisco<\/strong><br \/>\nAI-First Integration: Aligning R&amp;D, Quality &amp; Product Development in Adhesives Industry<\/p>\n<p><strong>University of Alicante; ES-Alicante<\/strong><br \/>\nNew Insights into the Influence of Adhesive Thickness on Tack at 20 \u00bac in Hot Melt Pressure Sensitive Adhesives Supported on Paper<\/p>\n<p><strong>University of Applied Sciences; DE-M\u00fcnchen<\/strong><br \/>\nTBA<\/p>\n<p><strong>University of Applied Sciences Bonn-Rhein-Sieg; DE-Sankt Augustin<\/strong><br \/>\nDeveloping \u201cSkin\u201d for in Vitro Adhesion Testing \u2013 Combining Material Sciences, Analytics and Data Science<\/p>\n<p><strong>University of Applied Sciences Bonn-Rhein-Sieg; DE-Rheinbach<\/strong><br \/>\nVisual Deformation Analysis of Applied Medical Patches During Motion Sequences on Upper and Lower Arm<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Already submitted papers Albert Invent; US-Oakland TBA artimelt; CH-Sursee TBA Aumovio Germany; DE-Babenhausen Display Bonding \u2013 Complex &amp; Challenging Technology AWA Alexander Watson Associates; NL-Amsterdam Global Pressure-Sensitive Adhesives Market Overview ENTEX Rust &amp; Mitschke; DE-Bochum Easy Processing of Challenging Adhesives Formulations Using a Planetary Roller Extruder Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM;<\/p>\n","protected":false},"author":1,"featured_media":3937,"parent":405,"menu_order":1,"comment_status":"closed","ping_status":"closed","template":"template-montag.php","meta":{"ngg_post_thumbnail":0,"footnotes":""},"class_list":["post-428","page","type-page","status-publish","has-post-thumbnail","hentry","has-thumbnail"],"_links":{"self":[{"href":"https:\/\/www.mkvs.de\/en\/wp-json\/wp\/v2\/pages\/428","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.mkvs.de\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.mkvs.de\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.mkvs.de\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.mkvs.de\/en\/wp-json\/wp\/v2\/comments?post=428"}],"version-history":[{"count":1033,"href":"https:\/\/www.mkvs.de\/en\/wp-json\/wp\/v2\/pages\/428\/revisions"}],"predecessor-version":[{"id":7165,"href":"https:\/\/www.mkvs.de\/en\/wp-json\/wp\/v2\/pages\/428\/revisions\/7165"}],"up":[{"embeddable":true,"href":"https:\/\/www.mkvs.de\/en\/wp-json\/wp\/v2\/pages\/405"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.mkvs.de\/en\/wp-json\/wp\/v2\/media\/3937"}],"wp:attachment":[{"href":"https:\/\/www.mkvs.de\/en\/wp-json\/wp\/v2\/media?parent=428"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}