„CALL FOR PAPERS“

We kindly invite interested Speakers to submit a „Call for papers“ of their presentation for the 50. MKVS 2025.
» Call for papers 2025

Already submitted papers:

artimelt; CH-Sursee
TBA

AWA Alexander Watson Associates; NL-Amsterdam
Overview Adhesive Market

Collano; CH-Sempach Station
TBA

Dr. Hönle; DE-Gilching
UV-Dose-Measurement at Substrate Level: Benefits and Limitations

FKS Group; ID-Jakarta
Current insights from Indonesia into Application of Hot melt Adhesives in Corrugated Board as well as Packaging Materials with Barrier Properties

Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM; DE-Bremen
Biobased Alternatives for Hotmelt Adhesives

FSNCadvisor; BE- Overijse
Navigating the Future: Key Factors Shaping Adhesive Raw Materials

Fujifilm Europe; DE-Ratingen
Visualization of Pressure Distribution in Bonding Processes

ICAD Technology; DK-Holte
A Closed-Loop UV Control System Enhancing Product Quality and Reducing Energy Consumption

IVK – German Adhesives Association; DE-Düsseldorf
TBA

Jowat; DE-Detmold
TBA

Mondi Group, DE-Raubling
A Release Liner Manufacturer’s path to Sustainable Solutions for the Pressure Sensitive Market

NETZSCH-Gerätebau; DE-Selb
Rheological Test Methods for Quality Control in Adhesive Technology

Organik Kimya; TR-Istanbul
TBA

pacoon | strategie + design; DE-München
TBA

Pontacol; CH-Schmitten
Towards Sustainable Thermoplastic Adhesive Films

Power2Polymers; DE-Aachen
Sustainable POM-Containing Polyols for Industrial Adhesives

PTS – Institut für Fasern & Papier; DE-Heidenau
Starch Based Hot Melt Adhesives as Bio-Based Alternatives to Conventional Systems

Sekisui-Alveo; CH-Adligenswil
Evaluation of High Performance Foam for Flexoprinting Plate Mounting Tapes

Synthomer; NL-Middelburg
Synthomer´s Sustainability Actions: Insights into BIO, CIRCLE and CLIMA Portfolio Offerings

tesa; DE-Norderstedt
Lateral Coextrusion Technology for Manufacturing Adhesive Tapes

TITK – Thüringisches Institut für Textil- und Kunststoff-Forschung; DE-Rudolstadt
Caremelt® – Development of a Bio-based and Biodegradable Hot-Melt Adhesive System

TSRC Corporation; LU-Luxembourg
Hot Melt PSA Formulations for Labels Based on a Novel SIS Polymer

University of Alicante; ES-Alicante
Why Adding Fillers to Adhesives? Pros and Cons of an old but Current Practice in Academia and Industry

University of Applied Sciences; DE-Munich
Saving Adhesive Through Temperature Control

Uth GmbH; DE-Fulda
New Process Technology for Dosing, Transportation, Filtration and Coating of Highly Viscous Adhesives