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08:00              
MorninG MEET AND GREET

09:00 – 09:25 
LabV Intelligent Solutions; DE-Selb
Charles Jouanique
From Data Chaos to AI-Driven Decisions in Formulation Development
»Abstract

09:25 – 09:50 
Bluestar Silicones (formerly Elkem Silicones); FR-Saint-Fons
Dr. Sebastien Marrot
Shaping the Future of Silicone PSAs: Technology Choices Driving Market Transformation
»Abstract

09:50 – 10:15 
Mondi Group; DE-Raubling
Dr. Tobias Nienke
Insights into the Release Liner Toolkit – Selecting the Right Tool for Pressure-Sensitive Adhesives
»Abstract

10:15 – 10:45    Networking coffee break with the Exhibitors

10:45 – 11:10 
UPM Specialty Materials and Wacker Chemie ; FI-Helsinki and DE-Burghausen
Mikko Rissanen
Power of Collaboration in Silicone Coating of Paper
»Abstract

11:10 – 11:35 
University of Applied Sciences Bonn-Rhein-Sieg; DE-Rheinbach
Alexander Jaekel
Developing “Skin” for in vitro Adhesion Testing –
Combining Material Sciences, Analytics and Data Science
»Abstract

11:35 – 12:00 
artimelt; CH-Sursee
Nicole Senn
No Simple Substrate: Human Skin-Key Considerations for HMPSAs in Medical Devices
»Abstract

12:00 – 12:25 
University of Applied Sciences Bonn-Rhein-Sieg; DE-Rheinbach
Dr. Michael Meurer
Visual Deformation Analysis of Applied Medical Patches During Motion Sequences on Upper and Lower Arm
»Abstract

12:30 – 14:00    Networking lunch

14:00 – 14:25 
Synthomer; DE-Marl
Dr. Kristin Schöne
Sustainability In Polymer Dispersions for Tape and Label Applications
»Abstract

14:25 – 14:50 
Rain Carbon Germany; DE-Duisburg
Dr. Matthias Steffen
Tackifier Resins in UV-Curable PSA Tapes: Selective Tackifier use for Performance and Efficient Curing
»Abstract

14:50 – 15:15 
KEMI PINE ROSINS; PT-Cantanhede
André Gaspar
Formulation of Low-Carbon Hot-Melt Adhesives:
Integrating Rosin Ester Tackifiers with Metallocene-Polyethylene and Bio-Polyamide Frameworks

15:15 – 15:45    Networking coffee break with the Exhibitors

15:45 – 16:10 
PTS – Institut für Fasern & Papier; DE-Heidenau
Gerrit Schaper
COLLAMELT – Collagen-Based Thermoplastic Adhesives and Sealing Materials for the Paper Industry
»Abstract

16:10 – 16:35 
University of Alicante; ES-Alicante
Prof. José Miguel Martin Martinez
New Insights into the Influence of Adhesive Thickness on Tack at 20º C in Hot Melt Pressure Sensitive Adhesives Supported on Paper
»Abstract

16:35 – 17:00 
Aumovio Germany; DE-Babenhausen
Dr. Belinda Berns
Display Bonding – Complex & Challenging Technology
»Abstract