N.N.

MolecularGRIP™: A Leap Change in Solvent-free Priming of Difficult-to-Bond Materials
Marc Jacobs; Molecular Plasma Group; LU-Foetz 
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09:25 – 09:50 
3D Functionality – Printed Electronics Enables New Dimensions and Applications
Wolfgang Mildner; MSWtech; DE-Stein
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09:50 – 10:15 
Barrier Paper for Electronic Applications
Dr. Klaus Noller; Fraunhofer Institute for Process Engineering and Packaging IVV; DE-Freising
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10:15 – 10:45     Networking coffee break

10:45 – 11:10 
Biodegradability Sense or Nonsense
Dr. Peter Barth; CreativeNetworkConsulting; DE-Celle
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11:10 – 11:35 
Assessment and Analysis of Adhesives for Food Packaging
Dr. Ralf Derra; ISEGA Research and Investigation Company; DE-Aschaffenburg
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11:35 – 12:00 
Testing Off-Notes in Adhesive Products by Means of GC-Sniffing-MS Technique
Rita Ribau Domingues; Olfasense; DE-Kiel
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12:00 – 14:00    NETWORKING LUNCH

KATHARINA RAWERT; EVONIK Operations | Smart Materials; DE-MARL

14:00 – 14:30 
Biodegradability and Compostability of Packaging Materials: Testing and Validation
Dr. Ulrich Zang; ISEGA Research and Investigation Company; DE-Aschaffenburg
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14:30 – 15:00 
Compostable Adhesives for High-Gloss Lamination
Dr. Hartmut Henneken; Jowat Adhesives; DE-Detmold

15:00 – 15:30     Networking coffee break

15:30 – 15:55 
Novel Bio-based Liquid Tackifier for Food Contact Adhesive Applications
Dr. Jeroen van Herrikhuyzen; Kraton Chemical; NL-Almere
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15:55 – 16:20 
Breaking up with Epoxy Silanes – Consequences & Solutions in Flexible Food Packaging
Helga Garmann; Henkel; DE-Düsseldorf
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