Programm
Montag, 26. Oktober 2020

Our hybrid conference combines
a „live“ on-site  event with a  „virtual“ online component
 
CONFERENCE LANGUAGE: ENGLISH

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07:30 – 08:45                                                                                       
REGISTRATION

08:45
welcome
Stephan Hinterwaldner

OPENING SESSIONs KEYNOTES 

09:00 – 09:30  
The Green Deal and its Impact on the Adhesives Industry
DR. VERA HAYE; IVK – German Adhesives Association; DE-DÜSSELDORF
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09:3010:00 
Intelligence Saves Costs!
What REALLY COUNTS IN TERMS OF PRINT QUALITY!

Prof. Dr. Martin Dreher; DFTA Technology Center at Stuttgart Media University; DE-Stuttgart

10:00 – 10:30     Networking coffee break

CHAIR:

Dr. Frank Henke; Frank Henke Consulting; DE-Missen-Wilhams


10:3011:00 

Reactive Extrusion of Adhesives and Sealants in a Twinscrewextruder (ZSK)
Markus Fiedler; Coperion; DE-Stuttgart

11:0011:30 
Production of adhesives on the planetary roller extruder – A contemplation of resource efficiency
Dr. Thomas Birr; Entex Rust & Mitschke; DE-Bochum
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11:3012:00 
Simulation of Drying Processes in Conventional and Impingement Free Convection Dryers
Tobias Nienke; University of Applied Science; DE-Munich
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12:0012:30 
HTI SPECTRA HE™ ULTRA DRYING SYSTEMS. RECENT INSTALLATIONS IN WEB BASED APPLICATIONS AND MOLDED FIBER PRODUCTS
GENE PLAVNIK, Ph.D; HTI – HEAT TECHNHOLOGIEs INC.; US-ATLANTA / GA 
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12:30 – 14:00    NETWORKING LUNCH

14:0014:30 
LAOS-Measurement: How can it be Used for Material Characterization?
Sascha Rollka*, Prof. Dr. Klaus-Uwe Koch; Westphalian University of Applied Sciences; DE-Recklinghausen
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14:3015:00 
Addition of Graphene Oxide During Waterborne Polyurethane Synthesis for Improving its Adhesion Properties
Prof. José Miguel Martin-Martinez; University of Alicante; ES-Alicante
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15:0015:30 
MolecularGRIP™: A Leap Change in Solvent-free Priming of Difficult-to-Bond Materials
Marc Jacobs; Molecular Plasma Group; LU-Foetz 
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15:30 – 16:00     Networking coffee break

16:0016:30 
ELECTRONICS GO 3D – FROM PRINTED ELECTRONICS TO 3D STRUCTURAL ELECTRONICS – STATUS AND ROADMAP FOR NEW COMPACT 3D FUNCTIONAL APPLICATIONS
Wolfgang Mildner; MSWtech; DE-Stein
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16:3017:00 
Barrier Paper for Printed Electronics
Dr. Klaus Noller; Fraunhofer Institute for Process Engineering and Packaging IVV; DE-Freising
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