26. – 28. Oktober 2026
PSA – HMPSA – Verpackungsklebstoffe – Flexible Verpackung
Neue Ansätze, Entwicklungen und Trends bei Rohstoffen
in den Bereichen Kleben, Verarbeitung, Anwendung und Verfahrenstechnik
Poster Session
Poster titles will follow soon
Posters can still be submited. Please contact us!
Presentations
Albert Invent; US-Oakland
Dr. Moritz Haus
The Lab that Never Forgets – Structured Institutional Knowledge as the New Competitive Currency in Adhesive Development
»Abstract
Aumovio Germany; DE-Babenhausen
Dr. Belinda Berns
Display Bonding – Complex & Challenging Technology
»Abstract
AWA Alexander Watson Associates; NL-Amsterdam
Global Pressure-Sensitive Adhesives Market Overview
ENTEX Rust & Mitschke; DE-Bochum
Frank Fuchs
Easy Processing of Challenging Adhesives Formulations Using a Planetary Roller Extruder
»Abstract
GEW (EC); UK-Crawley
Ryan Turner
Closed-Loop Ultraviolet (UV) Dose Control for UV-Curable HMPSA
»Abstract
Heat Technologies; US-Atlanta
Gene Plavnik, PhD
Improving Operatoions of Flexible Packaging Plants: A Case Study in Ultrasonic Curing of Water-Based Varnishes (OPV) on Food Packaging Materials
»Abstract
Jagenberg Converting Solutions; DE-Erlangen
Unlock the Full Potential of your Pressure Sensitive Adhesive Products: The rise of Slot Die Coating
Matthews Engineering; CH-Fribourg
Roger Bollström
Evolution of Gravure Coating Technology: From Overflow Chambers to Pressurized Gravure Systems and their Position Versus Curtain Coating
»Abstract
Molecular Plasma Group; BE-Leuven (Kessel-Lo)
Kevin Braun
MolecularGRIP – Functional Plasma Coatings for High-Performance Adhesion in R2R Applications
»Abstract
PRUUVE; DE-Dresden
Ulrich Leo
A Delayed-Phosphorescence-Based Dosimeter for Quantitative UV Process Characterization
»Abstract
TSE Troller; CH-Murgenthal
Harald Döll and Remo Andreas Ziörjen
High Precision Manufacturing of Slot- and Curtain Coating dies and the Resulting Quality of Coated Films
»Abstract
Uncountable; US-San Francisco
Tea Pavlek
AI-First Integration: Aligning R&D, Quality & Product Development in Adhesives Industry
»Abstract